Titlebook: Atomic Layer Deposition for Semiconductors; Choel Seong Hwang Book 2014 Springer Science+Business Media New York 2014 ALD for mass-product

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斗志

Erfolg, Misserfolg und Comeback,ed for leading edge manufacturing is complex with stringent requirements on within-wafer and wafer-to-wafer nonuniformity of thickness, composition, and resistivity. In addition, particle defects, step coverage, and wafer throughput, as measured by number of wafers processed per hour, are also key c

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Choel Seong HwangFirst book to connect missing link between semiconductor device engineers/designers and process engineers, material designers, and chemists.First book solely dedicated to the application of ALD to the

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