SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影響因子:2.373 (IEEE T COMP PACK MAN)

只看該作者 · 發(fā)表于 2025-3-23 11:05:05

Submitted on: 15 February 1999. Revised on: 01 April 1999. Accepted on: 09 May 1999. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

只看該作者 · 發(fā)表于 2025-3-23 14:42:21

Submitted on: 19 May 2009. Revised on: 11 July 2009. Accepted on: 31 July 2009. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

只看該作者 · 發(fā)表于 2025-3-23 20:24:02

只看該作者 · 發(fā)表于 2025-3-24 01:12:57

只看該作者 · 發(fā)表于 2025-3-24 03:34:03

Submitted on: 09 October 2015. Revised on: 07 November 2015. Accepted on: 01 December 2015. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

只看該作者 · 發(fā)表于 2025-3-24 09:29:39

只看該作者 · 發(fā)表于 2025-3-24 14:15:34

Submitted on: 11 June 2005. Revised on: 31 July 2005. Accepted on: 04 September 2005. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

只看該作者 · 發(fā)表于 2025-3-24 17:02:00

只看該作者 · 發(fā)表于 2025-3-24 19:48:42

只看該作者 · 發(fā)表于 2025-3-25 02:26:55

Submitted on: 21 May 2021. Revised on: 04 September 2021. Accepted on: 15 October 2021. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology

		自動(dòng)登錄	找回密碼
密碼			To register

關(guān)于派博傳思			派博傳思旗下網(wǎng)站			友情鏈接
派博傳思介紹	公司地理位置	論文服務(wù)流程	影響因子官網(wǎng)	吾愛(ài)論文網(wǎng)	大講堂	北京大學(xué)	Oxford Uni.	Harvard Uni.
發(fā)展歷史沿革	期刊點(diǎn)評(píng)	投稿經(jīng)驗(yàn)總結(jié)	SCIENCEGARD	IMPACTFACTOR	派博系數(shù)	清華大學(xué)	Yale Uni.	Stanford Uni.
\|Archiver\|手機(jī)版\|小黑屋\| 派博傳思國(guó)際 ( 京公網(wǎng)安備110108008328) GMT+8, 2025-10-5 17:21
Copyright © 2001-2015 派博傳思京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved