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SCIE期刊IEEE Transactions on Components Packaging and Manufacturing Technology 2024/2025影響因子:2.373 (IEEE T COMP PACK MAN)

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發(fā)表于 2025-3-21 16:22:21 | 只看該作者 |倒序瀏覽 |閱讀模式
期刊全稱IEEE Transactions on Components Packaging and Manufacturing Technology
期刊簡稱IEEE T COMP PACK MAN
影響因子20242.373
視頻videohttp://file.papertrans.cn/12/11944/11944.mp4
ISSN2156-3950
eISSN2156-3985
出版商IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
發(fā)行地址445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
學(xué)科分類1.Science Citation Index Expanded (SCIE)--Engineering, Manufacturing | Engineering, Electrical & Electronic | Materials Science, Multidisciplinary; 2.Current Contents Electronics & Telecommunications Collection--Signal Processing/Circuits & Systems; 3.Current Contents Engineering, Computing & Technology--Materials Science & Engineering; 4.Essential Science Indicators--Engineering;
出版語言English
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SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)影響因子@(工程，電氣和電子)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)總引論文


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)總引論文@(工程，電氣和電子)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)總引頻次@(工程，電氣和電子)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)即時影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)即時影響因子@(工程，電氣和電子)學(xué)科排名


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(20 21 REV HIST)五年累積影響因子


SCIE(SCI)期刊IEEE Transactions on Components Packaging and Manufacturing Technology(IEEE T COMP PACK MAN)五年累積影響因子@(工程，電氣和電子)學(xué)科排名


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沙發(fā)
發(fā)表于 2025-3-21 20:20:58 | 只看該作者
Submitted on: 12 December 2019. Revised on: 29 January 2020. Accepted on: 15 February 2020. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
板凳
發(fā)表于 2025-3-22 01:29:23 | 只看該作者
Submitted on: 29 May 2005. Revised on: 19 June 2005. Accepted on: 10 July 2005. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
地板
發(fā)表于 2025-3-22 07:09:16 | 只看該作者
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發(fā)表于 2025-3-22 19:37:13 | 只看該作者
Submitted on: 08 May 2006. Revised on: 30 August 2006. Accepted on: 20 September 2006. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
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發(fā)表于 2025-3-23 08:30:43 | 只看該作者
Submitted on: 15 July 2023. Revised on: 27 September 2023. Accepted on: 20 October 2023. ___________________IEEE Transactions on Components Packaging and Manufacturing Technology
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