Titlebook: Ultraclean Surface Processing of Silicon Wafers; Secrets of VLSI Manu Takeshi Hattori Book 1998 Springer-Verlag Berlin Heidelberg 1998 Tech

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Measurement of Particles on Wafer Surfacesr strongly in their detection principles. The use of particle detection on the mirror-polished and filmed wafers plays a major role in monitoring particle generation from equipment. For in-line monitoring and yield analysis, the investigation of patterned wafers is efficient.

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Analysis and Evaluation of Impurities on Wafer Surfacescal techniques are used for a macroscopic analysis, and physical techniques enable the analysis of the state of the contamination in the microscopic range. Table 13.1 lists various analytical methods for impurities on the silicon surface.

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Book 1998gh-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

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