Titlebook: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging; Materials, Processes Kim S. Siow Book 2019 Springer N

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Transient Liquid Phase Bonding, multicomponent alloy technologies based on such liquid alloys are being investigated in the form of films, foils, or particles for interconnect formation in a wide range of electronics applications, both as a substitute for high-Pb solders and as alternative thermal interface materials. In this chapter, we

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s, methods, and performance of these high-temperature die-at.This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In

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Morphological Changes in Sintered Silver Due to Atomic Migration,t diffusion and are responsible for rapid diffusion between sintered Ag and metallisations such as gold. The electromigration effect occurs when high current densities are present, leading to the electron wind force causing mass transport of Ag, creating voids and nanorods.

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John R. N. Taylor,Peter S. Beltoned in this chapter, modifications in Ag?paste formulation, sintering conditions, interfacial metallization, and innovative package designs will be able to alleviate these issues to improve the community’s confidence in this bonding technique.

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