Titlebook: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging; Materials, Processes Kim S. Siow Book 2019 Springer N

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Solenoidal Variable Bochner–Lebesgue Spaces tools to enable this control and reliability tests. The primary process steps of sintered Ag joints are substrate/wafer printing, preheating, die laminating, placement, and pressure sintering. Unlike solder joint, sintered Ag joint does not form intermetallic with the common substrates used in the

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Emerich Berghofer,Regine Schoenlechnere to the coolant. However, these materials are susceptible to failure when the package gets exposed to repeated changes in its thermal environment and internal temperature variations. Under these thermal conditions, the coefficient of thermal expansion mismatch between the different component layers

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John R. N. Taylor,Peter S. Beltongth, and related failure mechanisms under normal and accelerated conditions, as well as failure mechanism like electrochemical migration. While it is technically feasible to produce sintered Ag joint to meet the package design requirement, its long-term reliability is a subject of continuous researc

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Holly C. Pinkart,David C. Whiteent scenarios can be found in the following industries: oil and gas, aviation, geothermal drilling and subsurface monitoring, automotive, electrical power systems, combustion engine, nuclear power plant, foundries, glass plants, aluminum and steel mills, cement plant kiln, and aerospace. For all pha

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https://doi.org/10.1007/978-3-319-99256-3Sintered silver; Nano-silver sintering; Low temperature joining technology; Lead-free die attach; Power

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Springer Nature Switzerland AG 2019