Titlebook: Die-Attach Materials for High Temperature Applications in Microelectronics Packaging; Materials, Processes Kim S. Siow Book 2019 Springer N

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書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging影響因子(影響力)




書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging影響因子(影響力)學科排名




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書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging網絡公開度學科排名




書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging被引頻次




書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging被引頻次學科排名




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書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging讀者反饋




書目名稱Die-Attach Materials for High Temperature Applications in Microelectronics Packaging讀者反饋學科排名

積習難改

鐵砧

Process Control of Sintered Ag Joint in Production for Die Attach Applications,eps require additional care because of the absence of self-alignment?and ability to rework in a solid-state sintering process. In addition, the measurement of nano-sized porosity and voids is also crucial to control properties of the sintered Ag joint, such as density, thermal conductivity, and ther

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Thermomechanical Modeling of High-Temperature Bonded Interface Materials,lar in approach and implementation but different in the underlying theory—are discussed in the context of high-temperature bonded materials. In addition, a short review of sintered silver is provided, as it is widely seen as a potentially promising and reliable bonded material for high-temperature a

Migratory

DECRY

DECRY

Die-Attach Materials for Extreme Conditions and Harsh Environments, very long service periods, spanning 5–20?years of operation and in harsh environments, with equipment exposed to challenging environmental conditions with high temperature, shock, and vibration. For downhole reservoir well construction and production equipment, it is paramount to maximize efficienc

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Michael Ruzhansky,Ville Turunent interfaces. Therefore, silver sintering joint may possess porosity, which greatly reduces its bulk mechanical properties such as elastic modulus, yield strength, strength to failure, ultimate tensile strength, and Poisson’s ratio, as well as its thermal and electrical conductivities.

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Tincture