Titlebook: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits; Sung Kyu Lim Book 2013 Springer Science+Business Media New Yo

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978-1-4899-8696-2Springer Science+Business Media New York 2013

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General Principles of Preoperative Planningicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a

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