Titlebook: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits; Sung Kyu Lim Book 2013 Springer Science+Business Media New Yo

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https://doi.org/10.1007/978-94-024-2026-5inimum skew and constrained slew. Compared with the single-TSV solution, SPICE simulation results show that our multi-TSV approach significantly reduces the clock power by up to 15.9 % for two-die and 29.7 % for four-die stacks. In addition, the wirelength is reduced by up to 24.4 and 42.0 %..The ma

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I. Stefanou,J. Sulem,I. Vardoulakise goal of our holistic approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space exploration for early design stage. We also provide an in-depth comparison between T-TSV vs. MFC based cooling method and discuss how to employ DOE and RSM techniques

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https://doi.org/10.1007/978-3-642-82961-1 TSVs and STIs. Overall, TSV-STI-stress-induced timing variations can be as much as ± 15 % at the cell level. Thus, as an application to layout optimization, we exploit the stress-induced mobility enhancement to improve performance of 3D ICs. We show that stress-aware layout perturbation could reduc

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

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K.T. Chau,R.H.C. Wong,T.-f. Wongh-quality solutions in short runtime under the multi-objective goals. We provide comprehensive experimental results on making tradeoffs among performance, thermal, area, and wirelength for 3D ICs..The materials presented in this chapter are based on [25].

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