Titlebook: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits; Sung Kyu Lim Book 2013 Springer Science+Business Media New Yo

Panacea

jabber

Ethics

Chip/Package Co-analysis of Mechanical Stress for 3D ICons and reliability analysis. Finally, we study the mechanical reliability issues in practical 3D chip/package designs including wide-I/O and block-level 3D ICs..The materials presented in this chapter are based on [6].

Myocyte

溫室

雄辯

grenade

Regular Versus Irregular TSV Placement for 3D ICicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a

過(guò)份艷麗

Steiner Routing for 3D ICtruction and tree refinement. Our tree construction algorithm builds a delay-oriented Steiner tree under a given thermal profile. We show that our 3D tree construction involves minimization of two-variable Elmore delay function. In our tree refinement algorithm, we reposition the through-silicon-via

舊石器

Buffer Insertion for 3D IC study the fact that Through-Silicon-Vias (TSVs) have large parasitic capacitances that increase signal slew. Next, we develop a buffer insertion algorithm that improves the delay of both 3D and 2D nets in a 3D IC with explicit consideration of signal slew. The effectiveness of this technique is dem

大氣層

Low Power Clock Routing for 3D IC ICs). First, we study the impact of the TSV count and the TSV RC parasitics on clock power consumption. Several techniques are introduced to reduce the clock power consumption and slew of the 3D clock distribution network. We analyze how these design factors affect the overall wirelength, clock pow