Titlebook: Chemical-Mechanical Planarization of Semiconductor Materials; Michael R. Oliver (Rodel Fellow) Book 2004 Springer-Verlag Berlin Heidelberg

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Connotation

簡(jiǎn)潔

PET-scan

CMP Cleaning,nology hurdles, the CMP clean must also target manufacturing requirements driven by cost of ownership considerations. It is no small wonder then that many different cleaning technologies, both complimentary and competitive, are found in semiconductor manufacturing facilities.

高腳酒杯

高腳酒杯

D. W. Christianson,W. N. Lipscomby spin-on glass (SOG), reduce many of the problems of multi-level metal integration approaches, however SOG introduces additional difficulties of its own, and has been primarily used for two and three level metal structures [2].

Antarctic

Anthony Mittermaier,Erick Menesesreason the chapter is grouped into the major CMP process types: oxide, tungsten, STI and copper. There are other CMP processes, but these four areas cover most of the issues with the more uncommon processes, such as poly-silicon CMP.

ILEUM

CMP Technology,y spin-on glass (SOG), reduce many of the problems of multi-level metal integration approaches, however SOG introduces additional difficulties of its own, and has been primarily used for two and three level metal structures [2].

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