Titlebook: Area Array Interconnection Handbook; Karl J. Puttlitz,Paul A. Totta Book 2001 Kluwer Academic Publishers 2001 Potential.Scale.Wafer.develo

milligram

https://doi.org/10.1007/978-3-658-23316-7Wire bonds, tape automated bonding (TAB), and solder-bump, flip-chip connections more popularly referred to as controlled collapsed chip connections or C4 are the three primary chip-to-carrier interconnection technologies currently practiced.

重疊

Expanding the Economic Concept of ExchangeThe industry has focused on replacing packaged chips such as pin-in-hole (PIH) and surface-mount components (SMT) on cards or boards. Components which do not pass electrical test or inspection are removed from cards but not chips from single chip packages. In some instances, such as plastic molded packages, removal is not a viable option.

FLAIL

Flip-Chip Die Attach TechnologyWire bonds, tape automated bonding (TAB), and solder-bump, flip-chip connections more popularly referred to as controlled collapsed chip connections or C4 are the three primary chip-to-carrier interconnection technologies currently practiced.

Mortal

晚間

https://doi.org/10.1007/978-1-4615-1389-6Potential; Scale; Wafer; development; interconnect; manufacturing; material; metal; climate change

確定無疑

過分

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CANON

myriad

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