Titlebook: Area Array Interconnection Handbook; Karl J. Puttlitz,Paul A. Totta Book 2001 Kluwer Academic Publishers 2001 Potential.Scale.Wafer.develo

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Expanding the Economic Concept of ExchangeM) and their corresponding socket form factors are described ranging from small chip scale packages (CSP) having micro ball grid arrays (MBGA) to very large land grid arrays (LGA) having in excess of 5000 I/Os [1]. Module sizes correspondingly range from tens of millimeters to over one hundred milli

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Expanding the Economic Concept of Exchangeckaging. Although flip-chip interconnection, or controlled collapse chip connection (C4) as it is also known, has a long history prior to the use of any reinforcement [1]; the use of a polymeric material to surround the solder connections beneath attached chips has allowed flip chips with large die

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https://doi.org/10.1007/978-1-4615-0905-9tal migration, electromigration, creep, and thermomigration. Under normal field conditions, non-encapsulated open-array flip chip solder joints attached to alumina chip carriers exhibit the best reliability in the field among all interconnect methods. This, of course, is the result of following esta

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Stuart Cunningham,Peter S. Excellth increased speed and decreased energy consumption requirements has led to present day highly integrated circuits. To take advantage of the integration enhancements at the die level, much attention is focused on the supporting package performance.

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