Titlebook: Area Array Interconnection Handbook; Karl J. Puttlitz,Paul A. Totta Book 2001 Kluwer Academic Publishers 2001 Potential.Scale.Wafer.develo

Ergots

Ceramic and Plastic Pin Grid Array Technologyth increased speed and decreased energy consumption requirements has led to present day highly integrated circuits. To take advantage of the integration enhancements at the die level, much attention is focused on the supporting package performance.

頭盔

ANIM

誘惑

Wafer Bumpinge are immediate questions which emerge: Who will put bumps on chips and how? Will the same bumped chips be joined to both ceramic and organic packages? Must all chips be joined with high-melting or low-melting solders, or not with solder at all, but with conductive adhesives? This chapter will illus

合唱隊(duì)

neutrophils

packet

Tortuous

Ceramic Chip Carriersic chip carrier examples for each of the six market applications which include High Performance, Cost Performance, Commodity, Hand Held and Communication, Automotive and Memory. Materials and properties are summarized for standard alumina chip carriers, high-performance materials, thin-film material

戲法