Titlebook: Solder Joint Technology; Materials, Propertie King-Ning Tu Book 2007 Springer-Verlag New York 2007 development.manufacturing.material.mater

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Solder Reactions on Nickel, Palladium, and Goldn so as to achieve metallic bonds in a solder joint. For Pd and Au, they have been used as surface coating to passivate the surface of Cu and Ni as well as to enhance wetting reaction. Typically, the surface of Cu is protected by a thin film of Au and that of Ni is protected by a film of Pd. Often Au is used on Ni too.

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Introductionduct. Solder joints are ubiquitous. The essential process in solder joining is the chemical reaction between copper and tin to form intermetallic compounds having a strong metallic bonding. After the iron–carbon (Fe-C) binary system, copper–tin (Cu-Sn) may be the second most important metallurgical

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