| 書目名稱 | Solder Joint Technology |
| 副標題 | Materials, Propertie |
| 編輯 | King-Ning Tu |
| 視頻video | http://file.papertrans.cn/872/871495/871495.mp4 |
| 概述 | Addresses the urgent need for reliable, lead-free solders in electronic manufacturing.Reviews the basic science of copper-tin reactions and electromigration.Emphasizes reliability issues related to so |
| 叢書名稱 | Springer Series in Materials Science |
| 圖書封面 |  |
| 描述 | .Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1.st., 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.. |
| 出版日期 | Book 2007 |
| 關鍵詞 | development; manufacturing; material; materials; metal; reliability; thin film; quality control, reliabilit |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-0-387-38892-2 |
| isbn_softcover | 978-1-4419-2284-7 |
| isbn_ebook | 978-0-387-38892-2Series ISSN 0933-033X Series E-ISSN 2196-2812 |
| issn_series | 0933-033X |
| copyright | Springer-Verlag New York 2007 |
|Archiver|手機版|小黑屋|
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