Titlebook: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6; Proceedings of the 2 Antonio Baldi,Sharlotte L. B. Kram

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Residual Stresses at Critical Locations in Additively-Manufactured Components,ality: dimensional accuracy, mechanical strength, and fatigue performance. Residual stresses are central to these elements of component quality; however, they vary significantly at different locations in additively-manufactured parts. Multiple methods are used to assess residual stresses at critical

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Evaluating the Coefficient of Thermal Expansion of Electronic Board Using the Virtual Fields Methodlectronic packaging. Displacement data used for inverse analysis are obtained by digital image correlation which is a method for measuring displacement in the full field of view without contact. The virtual fields method based on the principle of virtual work is employed as a method for inverse anal

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