Titlebook: Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6; Proceedings of the 2 Antonio Baldi,Sharlotte L. B. Kram

草率女

convulsion

Inversion of Residual Stresses in Silicon Wafer from Surface Deflection Measurements, obtained by the propose method are compared. Also from actual deflection distribution of silicon wafers, Residual stresses are estimated by the proposed method. Results show that the residual stress in silicon wafers can be obtained by the proposed method.

Prologue

饒舌的人

Identification of Constitutive Parameters from Full Thermal and Kinematic Fields: Application to Hyntification of hyperelastic parameters from a heterogeneous heat source field. Due to large deformation undergone by the rubber specimen tested, a motion compensation technique is developed to plot the kinematic and thermal fields at the same points before reconstructing the heat source.

紅腫

Sputum

gustation

緯線

CRP743

Calorific Analysis of a Granular System Made in Shape Memory Alloy, thermography. Production and absorption of latent heat were observed in the contact zones between cylinders. Results enable us to envisage the circulation of a fluid through the SMA granular material for heat transfer.

濕潤(rùn)