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Titlebook: Rapid Thermal Processing of Semiconductors; Victor E. Borisenko,Peter J. Hesketh Book 1997 Springer Science+Business Media New York 1997 c

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書目名稱Rapid Thermal Processing of Semiconductors
編輯Victor E. Borisenko,Peter J. Hesketh
視頻videohttp://file.papertrans.cn/822/821222/821222.mp4
叢書名稱Microdevices
圖書封面Titlebook: Rapid Thermal Processing of Semiconductors;  Victor E. Borisenko,Peter J. Hesketh Book 1997 Springer Science+Business Media New York 1997 c
描述Rapid thermal processing has contributed to the development ofsingle wafer cluster processing tools and other innovations inintegrated circuit manufacturing environments. Borisenko and Heskethreview theoretical and experimental progress in the field, discussinga wide range of materials, processes, and conditions. They thoroughlycover the work of international investigators in the field.
出版日期Book 1997
關(guān)鍵詞crystal; diffusion; segregation; semiconductor; thin films
版次1
doihttps://doi.org/10.1007/978-1-4899-1804-8
isbn_softcover978-1-4899-1806-2
isbn_ebook978-1-4899-1804-8
copyrightSpringer Science+Business Media New York 1997
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978-1-4899-1806-2Springer Science+Business Media New York 1997
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Recrystallization of Implanted Layers and Impurity Behavior in Silicon Crystals,or in silicon are presented and discussed. In particular, the distinct features based on the nonequilibrium conditions created in RTP are emphasized. These phenomena have been investigated for the most part in the solid state for silicon.
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Rapid Thermal Oxidation and Nitridation,e oxide thickness decreases and the gate capacitance increases. In EEPROMs Fowler-Nordheim (FN) tunneling current, which is used to charge and discharge the gate of the memory cell, can slowly degrade the gate dielectric properties through trapped charges in the gate dielectric. The resultant shift
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