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Spray Coating Technology of Photoresist/Polymer for 3-D Patterning and Interconnect,sumption for the application of intermediate layers for wafer interconnect purposes. The integrated method offers an enabling technology for patterning of extensive topography and wafer-level intermediate layer application typically required for a multitude of MEMS structures and designs, novel inte

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Uncooled Infrared Image Sensor of Dielectric Bolometer Mode Using Ferroelectric BST Thin Film Prepaperature of BST ferroelectric film. A stress-balanced structure of multi-layered membrane has been developed in order to avoid crack and deformation in the sensor fabrication process. Temperature Coefficient of Dielectric constant (TCD) of the MOD made BST (Ba:St 75:25) thin film is about 1%/K. Unif

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Book 2002l customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:a

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rporatist processes of inclusion allow for the social mobility of the leadership of subaltern groups. However, they do not always result in the reduction of structural inequality between groups, Moreover, unlike the struggle for citizenship that is based on universalistic conceptualizations of right

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