| 書目名稱 | Materials & Process Integration for MEMS | | 編輯 | Francis E. H. Tay | | 視頻video | http://file.papertrans.cn/626/625752/625752.mp4 | | 叢書名稱 | Microsystems | | 圖書封面 |  | | 描述 | The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high- volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:a | | 出版日期 | Book 2002 | | 關(guān)鍵詞 | X-ray; alloy; metals; polymer; polymers | | 版次 | 1 | | doi | https://doi.org/10.1007/978-1-4757-5791-0 | | isbn_softcover | 978-1-4419-5303-2 | | isbn_ebook | 978-1-4757-5791-0Series ISSN 1389-2134 | | issn_series | 1389-2134 | | copyright | Springer Science+Business Media New York 2002 |
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