Titlebook: MEMS Materials and Processes Handbook; Reza Ghodssi,Pinyen Lin Book 2011 Springer Science+Business Media, LLC 2011

修飾

偏見

浮雕寶石

切割

Additive Processes for Semiconductors and Dielectric Materials,s used in the fabrication of microelectromechanical systems (MEMS). These methods include chemical vapor deposition, epitaxy, physical vapor deposition, atomic layer deposition, and spin-on techniques. The materials featured in this chapter include silicon and its oxide, nitride, and carbide derivat

立即

Additive Processes for Metals,ommon examples include electrical conductors, mechanical structures, magnetic elements, thermal conductors, optical reflectors, and more. In this chapter, additive processes for metals are discussed in the context of their application in MEMS. Particular attention is paid to MEMS-centric processing

cravat

馬具

Additive Processes for Piezoelectric Materials: Piezoelectric MEMS,nd reliable piezoelectric thin films have limited the incorporation of piezoelectric thin films in MEMS. Advances in materials processing and a move toward system-in-package (SIP) concepts have pushed piezoelectric thin film devices toward mainstream acceptance. The advances in piezoelectric aluminu

肉身

SPALL

Dry Etching for Micromachining Applications,l systems. Dry etching processes consist of (1) purely chemical (spontaneous gas phase etching), (2) purely physical (ion beam etching or ion milling), and (3) a combination of both methods (reactive ion or plasma etching) for the controlled removal of desired substrate materials. Although some of t

擦試不掉