Titlebook: MCM C/Mixed Technologies and Thick Film Sensors; W. Kinzy Jones,Karel Kurzweil,Sylvia Mergui Book 1995 Springer Science+Business Media Dor

geometrician

High Performance Ceramic Modules and Packages,looking for lower cost alternatives than what has been available previously..With the advent of low temperature dielectric tape, finer grind thick film conductor inks and higher resolution emulsions a much higher density ceramic multichip module is now possible. This module is approaching what has b

eucalyptus

ABASH

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ALN Cofired MCM-C/D,ay with thin film processing, and the high speed (>2 GHz) electrical performance of deposited TiW-Au / polyimide interconnections and the cofired tungsten vias. The test cell supports a multilayer interconnect structure designed to allow for characterization of signal propagation properties (e.g. im

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有其法作用

JOT

Mass Memory Packaging for Space Applications, the satellite is not always in visibility of earth stations, and so cannot transmit its informations in real time. Optical and radar instruments are now generating high output data rates ten times higher than the maximum speed of the link between the spacecraft and the ground. The required capacity

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intelligible

Multi-Chip Module Applications in Satellite Communications,s (MCMs) and low cost packaging technologies — whose properties offer significant advantages in space and locations involving exposure to radiation. Communication via satellites located in space require performance at high frequencies in the microwave range (delivered by silicon or GaAs MMICs- monol

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