| 書(shū)目名稱(chēng) | MCM C/Mixed Technologies and Thick Film Sensors | | 編輯 | W. Kinzy Jones,Karel Kurzweil,Sylvia Mergui | | 視頻video | http://file.papertrans.cn/621/620088/620088.mp4 | | 叢書(shū)名稱(chēng) | NATO Science Partnership Subseries: 3 | | 圖書(shū)封面 |  | | 描述 | Multi-chip modules (MCMs) with high wiring density, controlledimpedance interconnects, and thermal management capability haverecently been developed to address the problems posed by advances inelectronic systems that make demands for higher speeds and complexity...MCM-C/Mixed Technologies and Thick Film Sensors. highlightsrecent advances in MCM-C technology. Developments in materials andprocesses which have led to increased interconnection density arereviewed: finer resolution thick film inks, highperformance-low temperature dielectric tapes, precision viageneration by both laser and mechanical methods, and enhanced screenprinting technologies have given us feature resolution to the 50mum line/space level. Thermal management has greatly benefittedfrom such new materials as cofire AIN and diamond. .MCM-C technology is compatible with thick film sensors, and work isreviewed on environmental gas sensors, pressure and temperaturesensors, and the development of novel materials in this area. . | | 出版日期 | Book 1995 | | 關(guān)鍵詞 | Laser; Sensor; communication; complexity; dielectrics; electronics; integrated circuit; optoelectronics; pol | | 版次 | 1 | | doi | https://doi.org/10.1007/978-94-011-0079-3 | | isbn_softcover | 978-94-010-4039-6 | | isbn_ebook | 978-94-011-0079-3Series ISSN 1388-6576 | | issn_series | 1388-6576 | | copyright | Springer Science+Business Media Dordrecht 1995 |
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