Titlebook: Interconnects in VLSI Design; Hartmut Grabinski Book 2000 Springer Science+Business Media Dordrecht 2000 Analysis.CMOS.FPGA.Field Programm

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A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology,w challenges in keeping signal integrity on silicon and minimizing switching noise radiated from the IC and propagated into the exterior system. Since these effects are treated as ”parasitic“ and thus not covered by state-of-the-art design and simulation tools for VLSIs, the EMC team at Infineon Tec

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Considering Magnetic Interference in Board-Level Interconnect Design,work simulator is presented. The method is well-suited for many low-frequency applications and in particular for circuit layout optimization purposes. Field-to-circuit coupling is described focussing on topological properties of the problem. After the electrical network is decomposed into tree and c

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Advanced Modeling of Nonuniform Interconnects, based on a weak formulation of the Nonuniform Multiconductor Transmission Lines (NMTL) equations through expansion and testing with suitable basis functions sets. Depending on the choice of these basis functions, it is possible to tune the behavior of the numerical scheme to the form of the expecte

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