| 書(shū)目名稱(chēng) | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| 編輯 | John W. Balde (IMAPS Fellow, IEEE Fellow) |
| 視頻video | http://file.papertrans.cn/345/344870/344870.mp4 |
| 叢書(shū)名稱(chēng) | Emerging Technology in Advanced Packaging |
| 圖書(shū)封面 |  |
| 描述 | .Foldable Flex and Thinned Silicon Multichip Packaging Technology. presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. . |
| 出版日期 | Book 2003 |
| 關(guān)鍵詞 | circuit; design; development; electronics; interconnect; material; microprocessor; power systems; processor; |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4615-0231-9 |
| isbn_softcover | 978-1-4613-4977-8 |
| isbn_ebook | 978-1-4615-0231-9Series ISSN 1572-087X |
| issn_series | 1572-087X |
| copyright | Springer Science+Business Media New York 2003 |
|Archiver|手機(jī)版|小黑屋|
派博傳思國(guó)際
( 京公網(wǎng)安備110108008328)
GMT+8, 2025-10-7 10:31
發(fā)表于 2025-3-21 17:36:50
