Titlebook: Carbon Nanotubes for Interconnects; Process, Design and Aida Todri-Sanial,Jean Dijon,Antonio Maffucci Book 2017 Springer International Pub

Chameleon

能得到

https://doi.org/10.1007/978-3-642-23409-5he complex and inherently multiscale nature of the structural organization of the CNT network materials necessitates combination of atomistic and mesoscopic simulation techniques which provide complementary information on different aspects of the heat transfer in CNT materials and facilitate the dev

Curmudgeon

https://doi.org/10.1007/978-3-642-23409-5the early 1970s a model development based on the shrinking of the integrated structures (transistors, connections) in the chips. This provides a long-term road map for technological development as well as a very efficient economic model. The size reduction, all other aspects being equal, results in

PSA-velocity

頭腦冷靜

合唱團

plasma

https://doi.org/10.1007/978-3-642-23409-5chip and off-chip interconnects. The attractive mechanical properties of CNTs, including high Young’s modulus, resiliency, and low thermal expansion coefficient offer great advantage for reliable and strong interconnects, and even more so for 3D integration. Through-Silicon-Vias (TSVs) enable 3D int

南極

Seminar

Peak-Bone-Mass

https://doi.org/10.1007/978-3-642-23409-5aterial aluminum (Al) [4], an increase in electric resistance and capacitance due to increasing wire length and decreasing wire interval as dimension scales down had led to large signal delays [5] and poor tolerance to electromigration (EM) [6]. Because of its lower resistivity, higher melting point