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Titlebook: Carbon Nanotubes for Interconnects; Process, Design and Aida Todri-Sanial,Jean Dijon,Antonio Maffucci Book 2017 Springer International Pub

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11#
發(fā)表于 2025-3-23 11:07:28 | 只看該作者
Book 2017 also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
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發(fā)表于 2025-3-23 15:01:49 | 只看該作者
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發(fā)表于 2025-3-23 19:18:46 | 只看該作者
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發(fā)表于 2025-3-23 23:31:15 | 只看該作者
https://doi.org/10.1007/978-3-319-29746-03D Integrated Circuits; Carbon Nanotubes; Carbon Nanotubes and Nanostructures; Graphene; Graphene Nanori
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發(fā)表于 2025-3-24 04:19:22 | 只看該作者
978-3-319-80642-6Springer International Publishing Switzerland 2017
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發(fā)表于 2025-3-24 08:45:23 | 只看該作者
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發(fā)表于 2025-3-24 13:35:50 | 只看該作者
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發(fā)表于 2025-3-24 17:29:04 | 只看該作者
https://doi.org/10.1007/978-3-642-23409-5in the next decade is the degrading interconnect performance. Interconnects limit the performance of integrated circuits (IC) because they add extra delay to critical paths, dissipate dynamic power, disturb signal integrity, and impose reliability concerns due to electromigration (EM) and time-depen
19#
發(fā)表于 2025-3-24 22:42:36 | 只看該作者
https://doi.org/10.1007/978-3-642-23409-5as a core and foundation of the electronic information technology has a great influence on the daily life of human being. The semiconductor technology and IC industry have become an important symbol to embody a country’s comprehensive scientific and technological capability. In order to improve circ
20#
發(fā)表于 2025-3-25 00:09:26 | 只看該作者
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