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Titlebook: Boundary-Scan Test; A Practical Approach Harry Bleeker,Peter Eijnden,Frans Jong Book 1993 Springer Science+Business Media Dordrecht 1993 Ha

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發(fā)表于 2025-3-21 17:04:06 | 只看該作者 |倒序瀏覽 |閱讀模式
期刊全稱Boundary-Scan Test
期刊簡稱A Practical Approach
影響因子2023Harry Bleeker,Peter Eijnden,Frans Jong
視頻videohttp://file.papertrans.cn/191/190056/190056.mp4
圖書封面Titlebook: Boundary-Scan Test; A Practical Approach Harry Bleeker,Peter Eijnden,Frans Jong Book 1993 Springer Science+Business Media Dordrecht 1993 Ha
影響因子The ever-increasing miniaturization of digital electronic components is hampering the conventional testing of Printed Circuit Boards (PCBs) by means of bed-of-nails fixtures. Basically this is caused by the very high scale of integration of ICs, through which packages with hundreds of pins at very small pitches of down to a fraction of a millimetre, have become available. As a consequence the trace distances between the copper tracks on a printed circuit board cmne down to the same value. Not only the required small physical dimensions of the test nails have made conventional testing unfeasible, but also the complexity to provide test signals for the many hundreds of test nails has grown out of limits. Therefore a new board test methodology had to be invented. Following the evolution in the IC test technology. Boundary-Scan testing hm; become the new approach to PCB testing. By taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.
Pindex Book 1993
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taking precautions in the design of the IC (design for testability), testing on PCB level can be simplified 10 a great extent. This condition has been essential for the success of the introduction of Boundary-Sc,m Test (BST) at board level.978-1-4613-6371-2978-1-4615-3132-6
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https://doi.org/10.1007/978-3-540-32753-0m in a following section. By searching the minimum test vector set for memory interconnect tests, it is proven that BST is an excellent tool for these type of tests as well. In the last section an architecture of a Boundary-Scan test flow is given.
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BST Design Languages,can applications in various phases of the product life cycle, where ‘product’ may be defined as IC, PCB or system. Table 4-1 intends to place the various tools in their right context, which may be useful when reading this chapter.
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