Titlebook: Advanced Materials for Thermal Management of Electronic Packaging; Xingcun Colin Tong Book 2011 Springer Science+Business Media, LLC 2011

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978-1-4614-2792-6Springer Science+Business Media, LLC 2011

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Electronic Packaging Materials and Their Functions in Thermal Managements,doing business, based on corporate values included in strategy and daily operations. Moreover, the current financial crisis has shown how business activities solely motivated by the desire for short-term profit can have serious global consequences, while, in order to achieve sustainable practices, b

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High Thermal Conductivity Metal Matrix Composites,s of requirements of DC and hybrid microgrids of the future..This reference book provides a detailed discussion on the protection challenges that arise due to technological improvements in transmission and distribution systems to supply increasing power demand. The primary focus of this book is tran

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Thermally Conductive Ceramic Matrix Composites,ve loss of material from the surface due to the continuous impact of solid particles. This type of wear affects numerous industries, such as power generation, mining, and the pneumatic transportation of solids. The worst case scenario normally occurs where there is a combination of both erosion and

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Thermal Interface Materials in Electronic Packaging,asylum. It ensures the protection of persons who are persecuted because of particular fears or based on their personal ideas or beliefs, and who risk being subjected to torture, cruel, inhuman or degrading treatment or punishment if returned to their country of origin or a third country. It thus pro

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Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks,vative computational tools - web applications.Contains contr.Current knowledge and state-of-the-art developments in topics related to the seismic performance and risk assessment of different types of structures and building stock are addressed in the book, with emphasis on probabilistic methods. The