Titlebook: Advanced Materials for Thermal Management of Electronic Packaging; Xingcun Colin Tong Book 2011 Springer Science+Business Media, LLC 2011

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Back Matterstrained or inappropriate development, and urban sprawl are promoted unabated. Polar regions play a major role in the global agenda as they are rich in oil and other resources, marking them for contamination, o978-4-431-54672-6978-4-431-54006-9

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1437-0387 he fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufactur978-1-4614-2792-6978-1-4419-7759-5Series ISSN 1437-0387 Series E-ISSN 2197-6643

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Book 2011ensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufactur

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Xingcun Colin TongCovers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites.Provides the reader with a comprehensive understandin

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Springer Series in Advanced Microelectronicshttp://image.papertrans.cn/a/image/145901.jpg

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Advanced Materials for Thermal Management of Electronic Packaging978-1-4419-7759-5Series ISSN 1437-0387 Series E-ISSN 2197-6643

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https://doi.org/10.1007/978-1-4419-7759-5Thermal managing design guide; Thermal managing fundamentals; Thermally conductive materials; Thermoele