Titlebook: Wafer-Level Integrated Systems; Implementation Issue Stuart K. Tewksbury Book 1989 Kluwer Academic Publishers 1989 Flip-Flop.Generator.Prog

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Programmable Electronic Reconfiguration Switches,information may have to be externally loaded into the storage node (typically a flip-flop or a latch). In Figure 10.1, this external loading is provided by two global lines, one providing the switch state and the other a control signal loading that state into the storage node.

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Programmable Electronic Reconfiguration Switches,information may have to be externally loaded into the storage node (typically a flip-flop or a latch). In Figure 10.1, this external loading is provided by two global lines, one providing the switch state and the other a control signal loading that state into the storage node.

BOOM

Fabrication Defects, the specific defect mechanisms impacting interconnections. Any process line is a dynamically changing set of carefully engineered equipment, adjusted for example through evaluation of test wafers to achieve the highest possible yield of IC’s meeting reliability and performance requirements. Because

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Fabrication Defects, the specific defect mechanisms impacting interconnections. Any process line is a dynamically changing set of carefully engineered equipment, adjusted for example through evaluation of test wafers to achieve the highest possible yield of IC’s meeting reliability and performance requirements. Because

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Reliability and Failures,ilure mechanisms seen in silicon VLSI. Studies of the impact of scaling devices to smaller sizes on reliability are also reviewed, suggesting that the reliability issue will become more prominent as device dimensions shrink.

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Yield Models and Analysis,rs catch such violations. Another category of faults arises from statistical parameter variations arising during processing. Yield degradation due to such fabrication variations are called . [1,2,3], resulting in circuits which do not operate within specification. Though of considerable importance i