Titlebook: Wafer Scale Integration; Earl E. Swartzlander Book 1989 Kluwer Academic Publishers 1989 Programmable Logic.Signal.Software.VLSI.Wafer.comp

說不出

艦旗

Spare Allocation/Reconfiguration for WSI,m reliability. The focus is on spare allocation algorithms for architectures with dedicated spares and redundant interconnects. Integration of diagnosis and spare allocation is also examined. In conclusion an example computer-aided design and analysis workbench for reconfiguration algorithms and rec

machination

A WSI Image Processor, resolution image processing modules. Indeed, a number of VLSI chips, incorporating from 8 to 72 processing elements on a single Silicon die, are currently in development for the construction of SIMD image processing arrays. However, such image processing modules remain large and expensive, attracti

指耕作

A WSI Image Processor, resolution image processing modules. Indeed, a number of VLSI chips, incorporating from 8 to 72 processing elements on a single Silicon die, are currently in development for the construction of SIMD image processing arrays. However, such image processing modules remain large and expensive, attracti

Pander

Engaging

The 3-D Computer: An Integrated Stack of WSI Wafers,he attainment of an ever higher processing capability per unit volume. From the vacuum tube through the transistor, to the microelectronic era, and through a multitude of accompanying advances in physical packaging, the drive has consistently been to increase the amount of functional capability that

變色龍

Melanoma

昏迷狀態(tài)

High Yield In-Situ Fabrication of Multilevel Interconnections for WSI, this concept usually refers to a sequence of operations carried out in a single work chamber, or a series of such work chambers [1]. Figure 1 conceptually illustrates such a system which in this case is designed for Ultra High Vacuum (UHV) processing. The transfer from chamber to chamber is highly

啞巴