Titlebook: Wafer Scale Integration; Earl E. Swartzlander Book 1989 Kluwer Academic Publishers 1989 Programmable Logic.Signal.Software.VLSI.Wafer.comp

少量

軍械庫(kù)

Spare Allocation/Reconfiguration for WSI,m reliability. The focus is on spare allocation algorithms for architectures with dedicated spares and redundant interconnects. Integration of diagnosis and spare allocation is also examined. In conclusion an example computer-aided design and analysis workbench for reconfiguration algorithms and reconfigurable architectures is presented.

打算

Laser Restructurable Technology and Design,ystems have been fabricated and three of much larger size are being designed. Figure 1 shows one of these packaged WS circuits. The accomplishments and current research status of this project, which was conceived in 1979 [1], are described in this chapter.

Pert敏捷

Laser Restructurable Technology and Design,ystems have been fabricated and three of much larger size are being designed. Figure 1 shows one of these packaged WS circuits. The accomplishments and current research status of this project, which was conceived in 1979 [1], are described in this chapter.

使痛苦

GEAR

Promise and Pitfalls of WSI,d then, like the phoenix, a new set of innovators and investors rise from the ashes to make yet another attempt. By itself, this very process is informative. Talented people do not invest their time and money in ill conceived enterprises. They believed the risks could be managed, and that the prize

Aphorism

Feasibility of Large Area Integrated Circuits,ea have been much better publicized than successes. The especially spectacular failure of Trilogy [1] is still very well remembered though much less understood. Consequently, despite the undisputable potential of WSI, large area VLSI systems are still considered to be economically justifiable for mi

山間窄路

懶鬼才會(huì)衰弱

Architectural Yield Optimization,ductor researchers [1]. The expected benefits of smaller size, increased reliability, reduced cost, shorter signal delays, and simpler packaging are significant. Unfortunately, most of the previously reported attempts have been surpassed by increased density, improved circuitry, and better packaging

合唱隊(duì)