Titlebook: 3-Dimensional VLSI; A 2.5-Dimensional In Yangdong Deng,Wojciech P. Maly Book 2010 The Editor(s) (if applicable) and The Author(s), under ex

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https://doi.org/10.1007/978-1-4614-0058-5nclude wafer scale integration or multi-reticle wafer, multi-chip module, and 3-D integration. In this chapter we compared these different schemes in a unified cost analysis framework. Our model takes a few parameters extracted from representative fabrication and evaluates the cost efficiency. Our a

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Epilogue: The Future of the Disciplinereconfigurable data-path (PipeRench), are re-designed by exploiting fine-grain inter-chip interconnects. The 4th design study involves a 3-D stacked CPU/memory system. The above design cases studies validate the potential of the 2.5-D integration paradigm from a performance point of view.

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Chinese New Model of Modernization,nvision that the 2.5-D paradigm will be gradually adopted by CPUs, graphic processors, mixed-signal systems, and extremely highperformance applications. The 2.5-D technology would unleash the power to build VLSI applications that are hard to imagine today.

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