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Titlebook: 3-Dimensional VLSI; A 2.5-Dimensional In Yangdong Deng,Wojciech P. Maly Book 2010 The Editor(s) (if applicable) and The Author(s), under ex

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發(fā)表于 2025-3-21 18:19:11 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
期刊全稱3-Dimensional VLSI
期刊簡(jiǎn)稱A 2.5-Dimensional In
影響因子2023Yangdong Deng,Wojciech P. Maly
視頻videohttp://file.papertrans.cn/101/100639/100639.mp4
發(fā)行地址A new integration scheme considering both performance and yield.Novel cost model to compare difference integration styles.Design driven approach to prove the performance advantages of 2.5/3-D IC‘s.Ful
圖書封面Titlebook: 3-Dimensional VLSI; A 2.5-Dimensional In Yangdong Deng,Wojciech P. Maly Book 2010 The Editor(s) (if applicable) and The Author(s), under ex
影響因子."3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D...Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA..
Pindex Book 2010
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發(fā)表于 2025-3-21 22:49:25 | 只看該作者
Book 2010signers, and those working in EDA R&D...Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA..
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發(fā)表于 2025-3-22 11:55:29 | 只看該作者
Book 2010ed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (ED
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The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer-Verlag GmbH, DE
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發(fā)表于 2025-3-22 21:36:12 | 只看該作者
A New Unified Theory of Psychologye will propose our target 2.5-D integration scheme, and then explain its advantages. The fabrication, testing, and design technologies to enable the 2.5-D scheme are explained. Finally we are going to introduce the objectives and organization of this book.
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發(fā)表于 2025-3-23 08:58:54 | 只看該作者
,Seeking a Chinese Path (1956–1976),LSI circuits consisting of both standard cells and macros. The detailed result analysis justifies the potential of the 2.5-D integration approach to improve system performance and lower interconnect power consumption.
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