| 書目名稱 | Thermal Management of Electronic Systems | | 副標題 | Proceedings of EUROT | | 編輯 | C. J. Hoogendoorn,R. A. W. M. Henkes,C. J. M. Lasa | | 視頻video | http://file.papertrans.cn/925/924368/924368.mp4 | | 圖書封面 |  | | 描述 | The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera- tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the b | | 出版日期 | Conference proceedings 1994 | | 關(guān)鍵詞 | design; development; measurement techniques; packaging; stress | | 版次 | 1 | | doi | https://doi.org/10.1007/978-94-011-1082-2 | | isbn_softcover | 978-94-010-4472-1 | | isbn_ebook | 978-94-011-1082-2 | | copyright | Springer Science+Business Media Dordrecht 1994 |
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