Titlebook: Structure and Bonding; C. K. J?rgensen,J. B. Neilands,R. J. P. Williams Conference proceedings 1967 Springer-Verlag Berlin Heidelberg 1967

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書(shū)目名稱Structure and Bonding影響因子(影響力)

書(shū)目名稱Structure and Bonding影響因子(影響力)學(xué)科排名

書(shū)目名稱Structure and Bonding網(wǎng)絡(luò)公開(kāi)度

書(shū)目名稱Structure and Bonding網(wǎng)絡(luò)公開(kāi)度學(xué)科排名

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書(shū)目名稱Structure and Bonding讀者反饋學(xué)科排名

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Relations between softness, covalent bonding, ionicity and electric polarizability,

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K. Fajanso evaluate and bill product-related information in a future Internet of Things, based on an extended EPCglobal Architecture. Further opportunities and threats are discussed to provide an overview of its future 978-3-642-43697-0978-3-642-27991-1

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C. K. J?rgenseno evaluate and bill product-related information in a future Internet of Things, based on an extended EPCglobal Architecture. Further opportunities and threats are discussed to provide an overview of its future 978-3-642-43697-0978-3-642-27991-1

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D. Babel solutions for an evaluation scenario is presented, providing a technical infrastructure to evaluate and bill product-related information in a future Internet of Things, based on an extended EPCglobal Architecture. Further opportunities and threats are discussed to provide an overview of its future

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https://doi.org/10.1007/BFb0118877bonding; chemical bond; chemistry; molecule; structure; transition element

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