| 書目名稱 | Solder Paste in Electronics Packaging | | 副標(biāo)題 | Technology and Appli | | 編輯 | Jennie S. Hwang | | 視頻video | http://file.papertrans.cn/872/871496/871496.mp4 | | 圖書封面 |  | | 描述 | One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics | | 出版日期 | Book 1989 | | 關(guān)鍵詞 | assembly; coating; electronics; laser; manufacturing; metals; packaging | | 版次 | 1 | | doi | https://doi.org/10.1007/978-94-011-6050-6 | | isbn_softcover | 978-94-011-6052-0 | | isbn_ebook | 978-94-011-6050-6 | | copyright | Van Nostrand Reinhold 1989 |
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