Titlebook: Solder Joint Reliability Assessment; Finite Element Simul Mohd N. Tamin,Norhashimah M. Shaffiar Book 2014 Springer International Publishing

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Application I: Solder Joint Reflow Process,high reliability of the assembly. In this respect, finite element (FE) simulation with an appropriate model for the geometry of the assembly and suitable material models can be employed to describe the mechanics of the materials during the solder joint reflow cooling process.

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earch teams who study proteins, for example of human fluids, and who will certainly be interested in the application of new but simply described methods. At the same time we present the student with some more complicated physical techniques which are, however, simply described and easy to execute.

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