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Titlebook: Simulation by Bondgraphs; Introduction to a Gr Jean Ulrich Thoma Book 1990 Springer-Verlag Berlin Heidelberg 1990 Algebra.Bondgraphen.Dynam

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發(fā)表于 2025-3-21 16:09:47 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Simulation by Bondgraphs
副標題Introduction to a Gr
編輯Jean Ulrich Thoma
視頻videohttp://file.papertrans.cn/868/867592/867592.mp4
圖書封面Titlebook: Simulation by Bondgraphs; Introduction to a Gr Jean Ulrich Thoma Book 1990 Springer-Verlag Berlin Heidelberg 1990 Algebra.Bondgraphen.Dynam
描述Bondgraphs are a powerful tool in the simulation of mechanical, hydraulic, electric and thermal systems. They are used to represent engineering systems in written form by means of letter elements and their interconnections, called bonds, instead of in the form of numerous equations. They may be used to increase the efficiency of new product design. This book introduces the reader to bondgraphs and their use on PCs. A broad variety of applications of this method in the simulation of the above systems is presented. Twenty fully worked examples complement the presentation.
出版日期Book 1990
關鍵詞Algebra; Bondgraphen; Dynamics; calculus; design; efficiency; graphics; graphs; mechanical engineering; robot
版次1
doihttps://doi.org/10.1007/978-3-642-83922-1
isbn_softcover978-3-642-83924-5
isbn_ebook978-3-642-83922-1
copyrightSpringer-Verlag Berlin Heidelberg 1990
The information of publication is updating

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沙發(fā)
發(fā)表于 2025-3-21 22:46:37 | 只看該作者
板凳
發(fā)表于 2025-3-22 00:34:12 | 只看該作者
Simulation and Graphical System Models,pose is to get a quantitative understanding of their operation, improve their performance by variation of parameters and to find possible critical points before the actual system is built at a high expense. ..
地板
發(fā)表于 2025-3-22 05:20:14 | 只看該作者
Simulation and Design of Mechanical Engineering Systems, Now we are at a point where the way splits into the art of writing Bondgraphs (upper path) and into computation from Bondgraphs (lower path). Later they will approach each other again and become the Bondgraph way of life.
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發(fā)表于 2025-3-22 11:57:55 | 只看該作者
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發(fā)表于 2025-3-22 13:28:07 | 只看該作者
Electric Circuits, Drives and Components,n sec. 5.3 we shall examine the interaction of electric and magnetic fields with mechanical members in more detail. In this section we shall neglect parasitic effects of resistors, capacitors and inductors and treat them as R-, C- and I-elements. Thus, we neglect effects like inductivity of a resist
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發(fā)表于 2025-3-22 19:57:26 | 只看該作者
Computational Overview, Practical Procedures and Problems,the other program. In essence, a fully augmented Bondgraph (with all power directions and causalities) is equivalent to a set of equations that can be programed directly in language like BASIC, PASCAL, FORTRAN or C.
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發(fā)表于 2025-3-23 00:05:17 | 只看該作者
Applications to Thermodynamics, Chemistry and Biology,le 2.1) and entropy itself is accumulated entropy flow (Thoma 1970B). Hence the fundamental point to know is that thermal power in conduction, usually called heat flux, is absolute temperature times entropy flow. This fundamental equation appears in Fig. 7.1. Some important observations:
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發(fā)表于 2025-3-23 03:35:28 | 只看該作者
Selected Questions, of simple bonds that are somehow related. An example would be the movement of a robot hand in three dimensional space with speeds in the x, y and z directions. We can also think about the transformation into other coordinates, say polar coordinates, and this establishes the connection to mechanisms
10#
發(fā)表于 2025-3-23 07:25:50 | 只看該作者
Electric Circuits, Drives and Components,arasitic effects of resistors, capacitors and inductors and treat them as R-, C- and I-elements. Thus, we neglect effects like inductivity of a resistance, leakage of a capacitor and winding capacity of an inductor. Such effects can always be added from the known electronic equivalent circuits once the systematic writing of Bondgraphs is familiar.
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