Titlebook: Silicon Photonics III; Systems and Applicat Lorenzo Pavesi,David J. Lockwood Book 2016 Springer-Verlag Berlin Heidelberg 2016 Integrated si

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0303-4216 h centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.978-3-662-56847-7978-3-642-10503-6Series ISSN 0303-4216 Series E-ISSN 1437-0859

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Silicon Photonics Packaging Automation: Problems, Challenges, and Considerations,ve a survey and an evaluation, respect to automation, on some of the most recent and interesting developments for silicon photonic packaging, in particular for the optical fiber coupling and the future desired pluggable solutions.

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Merits and Potential Impact of Silicon Photonics,tonics. In particular, we review silicon photonic circuits for wavelength-division multiplexing (WDM) transmitters, WDM receivers, coherent optical transmitters and coherent receivers, which all require photonic integration to reduce the cost and module size.

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VLSI Photonics for High-Performance Data Centers,hapter, we reviewed the development in architecture design, CMOS transceivers, and hybrid III–V-on-Si transceivers, particularly progress in HP, to unfold a technology roadmap of VLSI photonics application for data center from an industrial perspective.

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,CMOS Cost–Volume Paradigm and Silicon Photonics Production, evolving macro-landscape in datacom traffic and its impact on silicon photonics, other applications domains and their volume requirements, and stages in low volume production with their associated challenges.

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Book 2016onics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of