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Titlebook: Recent Progress in Lead-Free Solder Technology; Materials Developmen Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az Book 2022 The Edito

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發(fā)表于 2025-3-21 18:49:22 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Recent Progress in Lead-Free Solder Technology
副標(biāo)題Materials Developmen
編輯Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az
視頻videohttp://file.papertrans.cn/824/823310/823310.mp4
概述Comprehensive overview of current developments in the emerging field of Pb-free solder technology.Examines various technologies involving rigid and flexible PCB.Touches upon a vast array of special to
叢書名稱Topics in Mining, Metallurgy and Materials Engineering
圖書封面Titlebook: Recent Progress in Lead-Free Solder Technology; Materials Developmen Mohd Arif Anuar Mohd Salleh,Mohd Sharizal Abdul Az Book 2022 The Edito
描述This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.? The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
出版日期Book 2022
關(guān)鍵詞composite solder; intermetallic compound; electronic packaging; solder technology; laser soldering
版次1
doihttps://doi.org/10.1007/978-3-030-93441-5
isbn_softcover978-3-030-93443-9
isbn_ebook978-3-030-93441-5Series ISSN 2364-3293 Series E-ISSN 2364-3307
issn_series 2364-3293
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
The information of publication is updating

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發(fā)表于 2025-3-21 21:42:13 | 只看該作者
Tin Whiskers Growth in Electronic Assemblieswth is induced by the relaxation of the compressive stress in the tin layer. Besides, the driving force for whisker growth increases with the temperature (<150?°C). Yet, annealing at 150?°C could reduce the whisker growth because grain coarsening reduces the inner compressive stress.
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Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Soldersain parameters and setup, and latest developments on the surface-modified ceramic-reinforced composite lead-free solders. Finally, the chapter also summarised and discussed the advantages, current trends, and significant findings in this field.
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Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder current electronics packaging desired performances. One of the leading choices in upgrading the existing lead-free alloys is by ceramic composite technology approach. The addition of ceramic particles into lead-free solder has altered and subsequently improved monolithic solder’s microstructural, p
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Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders solders. It is commonly known that composite solders experienced significant aggregation and non-wetting issues between the ceramic reinforcements and solder matrix, which makes the addition of the reinforcement phase inefficient in improving the properties of lead-free solders. Surface modificatio
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