| 書目名稱 | Reactive Sputter Deposition |
| 編輯 | Diederik Depla,Stijn Mahieu |
| 視頻video | http://file.papertrans.cn/822/821899/821899.mp4 |
| 概述 | Covers all the sputtering techniques for thin-film deposition.Describes the physical basics and related technical realization.Gives advice on controlling the sputter process and quality of the layers |
| 叢書名稱 | Springer Series in Materials Science |
| 圖書封面 |  |
| 描述 | The most straightforwardmethod to change the surface properties of a ma- rial is to deposit a thin ?lm or coating on it. Hence, it is not surprising that an overwhelming amount of scienti?c and technical papers is published each year on this topic. Sputter deposition is one of the many so-called physical vapour deposition (PVD) techniques. In most cases, sputter deposition uses a magnetically enhanced glow discharge or magnetron discharge to produce the ions which bombard and sputter the cathode material. In the ?rst chapter of this book (Chap. 1), the details of the sputter process are discussed. Essential to sustain the discharge is the electron emission during ion bombardment. Indeed, the emitted electrons are accelerated from the target and can ionize gas atoms. The formed ions bombard again the target completing the s- taining process. A complete chapter is assigned to this process to highlight its importance (Chap. 2). Although the sustaining process can be described quite straightforward, a complete understanding of the magnetron discharge and the in?uence of di?erent parameters on the discharge characteristics is onlypossiblebymodelling(seeChap.3).Withthesethreechapters,the |
| 出版日期 | Book 2008 |
| 關鍵詞 | Helium-Atom-Streuung; Magnetron discharge modelling; Physical vapour deposition; Plasma characterizatio |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-3-540-76664-3 |
| isbn_softcover | 978-3-642-09536-8 |
| isbn_ebook | 978-3-540-76664-3Series ISSN 0933-033X Series E-ISSN 2196-2812 |
| issn_series | 0933-033X |
| copyright | Springer-Verlag Berlin Heidelberg 2008 |
|Archiver|手機版|小黑屋|
派博傳思國際
( 京公網(wǎng)安備110108008328)
GMT+8, 2025-10-22 05:13
發(fā)表于 2025-3-21 16:36:39
