Titlebook: RF and Microwave Microelectronics Packaging; Ken Kuang,Franklin Kim,Sean S. Cahill Book 2010 Springer-Verlag US 2010 3D packaging.RF and m

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Millimeter-Wave Chip-on-Board Integration and Packaging,y with the highly-automated die attachment and wire bonding operations used in the plastic packaging industry and places bare millimeter-wave chips in environmentally protected air cavities. Examples of millimeter-wave products utilizing this technology are described, and some price points are given.

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Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages,e problems are driven by consumers’ desire for increasing bandwidth (e.g., portable communications applications) and manufacturers’ desire to drive down system cost (e.g., taking advantage of volume manufacturing processes). This work describes a low-cost plastic QFN package possible of meeting thes

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Polymeric Microelectromechanical Millimeter Wave Systems,le filters, phase shifters, waveguide-fed horn antennas and waveguide-based feeding networks. Fundamental issues in polymer metallization process such as conformal and uniform deposition as well as mass transfer and current density effects on the novel in-channel electroplating encapsulation, surfac