Titlebook: Open, Laparoscopic and Robotic Hepatic Transection; Tools and Methods Isidoro Di Carlo Book 2012 Springer-Verlag Italia 2012 Hepatic transe

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Isidoro Di Carlo,Adriana Toroel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency

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Paolo Limongelli,Andrea Belli,Luigi Cioffi,Gianluca Russo,Alberto D’Agostino,Corrado Fantini,Giulio nd red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamenta

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Takuya Hashimoto,Norihiro Kokudo,Masatoshi Makuuchiel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency

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Helge Bruns,Jürgen Weitz,Michael Kremer,Markus W. Büchler,Peter Schemmernd red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamenta

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Palepu Jagannath,Deepak Chhabra,Rajiv Shahel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency

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Matteo Donadon,Guido Torzilliel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency