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Titlebook: On-Chip Inductance in High Speed Integrated Circuits; Yehea I. Ismail,Eby G. Friedman Book 2001 Kluwer Academic Publishers 2001 CMOS.Count

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發(fā)表于 2025-3-21 18:28:26 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱On-Chip Inductance in High Speed Integrated Circuits
編輯Yehea I. Ismail,Eby G. Friedman
視頻videohttp://file.papertrans.cn/702/701315/701315.mp4
圖書封面Titlebook: On-Chip Inductance in High Speed Integrated Circuits;  Yehea I. Ismail,Eby G. Friedman Book 2001 Kluwer Academic Publishers 2001 CMOS.Count
描述The appropriate interconnect model has changed several timesover the past two decades due to the application of aggressivetechnology scaling. New, more accurate interconnect models arerequired to manage the changing physical characteristics of integratedcircuits. Currently, .RC. models are used to analyze highresistance nets while capacitive models are used for less resistiveinterconnect. However, on-chip inductance is becoming more importantwith integrated circuits operating at higher frequencies, since theinductive impedance is proportional to the frequency. The operatingfrequencies of integrated circuits have increased dramatically overthe past decade and are expected to maintain the same rate of increaseover the next decade, approaching 10 GHz by the year 2012. Also, widewires are frequently encountered in important global nets, such asclock distribution networks and in upper metal layers, and performancerequirements are pushing the introduction of new materials for lowresistance interconnect, such as copper interconnect already used inmany commercial CMOS technologies. ..On-Chip Inductance in High Speed Integrated Circuits. deals withthe design and analysis of integrated circu
出版日期Book 2001
關(guān)鍵詞CMOS; Counter; circuit design; computer-aided design (CAD); design process; integrated circuit; interconne
版次1
doihttps://doi.org/10.1007/978-1-4615-1685-9
isbn_softcover978-1-4613-5677-6
isbn_ebook978-1-4615-1685-9
copyrightKluwer Academic Publishers 2001
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發(fā)表于 2025-3-22 00:04:38 | 只看該作者
Book 2001e accurate interconnect models arerequired to manage the changing physical characteristics of integratedcircuits. Currently, .RC. models are used to analyze highresistance nets while capacitive models are used for less resistiveinterconnect. However, on-chip inductance is becoming more importantwith
板凳
發(fā)表于 2025-3-22 01:47:33 | 只看該作者
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發(fā)表于 2025-3-22 09:39:37 | 只看該作者
Basic Transmission Line Theory,tance on the repeater insertion process is introduced later in this research monograph, some background behind the process of inserting repeaters into . interconnect is introduced in section 2.3 [39]-[45].
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發(fā)表于 2025-3-22 12:55:23 | 只看該作者
Characterizing Inductance Effects in , Trees,for the purpose of evaluating inductance effects. Rather, the entire tree should be examined for inductance effects as a single structure since a large interaction occurs among the different branches. It is therefore shown that applying a single line analysis to an . tree can cause misleading conclusions.
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發(fā)表于 2025-3-22 18:37:40 | 只看該作者
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發(fā)表于 2025-3-23 00:48:14 | 只看該作者
Mosfet Current T-Voltage Characteristics,is review of long channel behavior is followed in section 4.2 by a discussion of the alpha power law model that is used to characterize the current-voltage behavior of a MOSFET transistor in deep submicrometer CMOS technologies [108].
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發(fā)表于 2025-3-23 05:28:02 | 只看該作者
Effects of Inductance On The Propagation Delay and Repeater Insertion Process in , Lines,hapter is to highlight the significance of increasing inductance effects in current high performance digital integrated circuits with respect to on-chip interconnect and repeater insertion in . lines.
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發(fā)表于 2025-3-23 08:11:16 | 只看該作者
Conclusions, of three models: a short-circuit for short, low resistance, low capacitance wires with high output impedance drivers, a lumped capacitance for those wires with low total resistance relative to the driver output resistance with non-negligible capacitance, and an . distributed impedance for longer, highly resistive wires.
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