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Titlebook: On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits; Qiang Cui,Juin J. Liou,Parthasarathy Srivatsan

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發(fā)表于 2025-3-21 19:52:35 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書(shū)目名稱On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits
編輯Qiang Cui,Juin J. Liou,Parthasarathy Srivatsan
視頻videohttp://file.papertrans.cn/702/701314/701314.mp4
概述Describes in detail the ESD phenomenon, as well as ESD protection fundamentals, standards, test equipment, and basic design strategies.Enables readers to design effective ESD protection solutions for
圖書(shū)封面Titlebook: On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits;  Qiang Cui,Juin J. Liou,Parthasarathy Srivatsan
描述This book enables readers to design effective ESD protection solutions for all mainstream RF fabrication processes (GaAs pHEMT, SiGe HBT, CMOS). The new techniques introduced by the authors have much higher protection levels and much lower parasitic effects than those of existing ESD protection devices.?The authors describe in detail the ESD phenomenon, as well as ESD protection fundamentals, standards, test equipment, and basic design strategies.?Readers will benefit from realistic case studies of ESD protection for RFICs and will learn to increase significantly modern RFICs’ ESD safety level, while maximizing RF performance.
出版日期Book 2015
關(guān)鍵詞ESD Protection for BiCMOS RFICs; ESD Protection for GaAs RFICs; ESD Protection for RFICs; ESD Protectio
版次1
doihttps://doi.org/10.1007/978-3-319-10819-3
isbn_softcover978-3-319-35824-6
isbn_ebook978-3-319-10819-3
copyrightSpringer International Publishing Switzerland 2015
The information of publication is updating

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發(fā)表于 2025-3-21 21:09:48 | 只看該作者
ts. Durch das Aufspüren eines vasoaktiven Materials in der Niere, das Renin-Angiotensin, wurde klar, da? es sich bei der Niere nicht nur um ein nützliches Ausscheidungsorgan für über-flüssige oder st?rende Chemikalien im K?rper handelt, sondern um ein Organ, das auch vorrangig auf die Hom?ostase des
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發(fā)表于 2025-3-22 02:11:47 | 只看該作者
Basics in ESD Protection of Radio Frequency Integrated Circuits,y threat as it is present in all IC manufacturing processes from mainstream silicon-based complementary metal–oxide–semiconductor (CMOS) to the more exotic compound semiconductor processes such as gallium arsenide (GaAs) or gallium nitride (GaN).
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發(fā)表于 2025-3-22 04:37:33 | 只看該作者
On-Chip Protection Solution for Radio Frequency Integrated Circuits in Standard CMOS Process,ing sufficient ESD protection for RF and high-speed mixed signal ICs using mainstream CMOS processes imposes a major design and reliability challenge. Ideally ESD protection must be transparent to the protected core circuitry under normal operation conditions. In reality, interaction always exists b
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Conclusion, and other high-speed applications. The reliable daily usage of these RF electronics cannot be assured, however, unless the issue of electrostatic discharge (ESD) protection is properly addressed and implemented. As the semiconductor technology continues to scale down, ESD reliability concern is bec
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發(fā)表于 2025-3-23 00:36:40 | 只看該作者
On-Chip Protection Solution for Radio Frequency Integrated Circuits in Standard CMOS Process,ges in RF ESD design, as a low capacitance typically means a small device area and consequently a poor robustness of the ESD protection device. Other concerns in ESD design for RF ICs include the signal distortion due to the nonlinearity of the parasitic capacitance, the noise coupling as well as no
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