Titlebook: Neural Networks; Proceedings of the S E. R. Caianiello (Professor) Conference proceedings 1968 Springer-Verlag Berlin · Heidelberg 1968 man

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W. Rallok, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed..978-1-4419-2284-7978-0-387-38892-2Series ISSN 0933-033X Series E-ISSN 2196-2812

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E. F. Evansok, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed..978-1-4419-2284-7978-0-387-38892-2Series ISSN 0933-033X Series E-ISSN 2196-2812

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V. Braitenbergok, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed..978-1-4419-2284-7978-0-387-38892-2Series ISSN 0933-033X Series E-ISSN 2196-2812

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W. S. McCullochsurface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics 978-94-011-6052-0978-94-011-6050-6

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E. R. Caianiello,A. de Luca,L. M. Ricciardiunting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics

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