Titlebook: Nanopackaging: From Nanomaterials to the Atomic Scale; Proceedings of the 1 Xavier Baillin,Christian Joachim,Gilles Poupon Conference proce

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Designing Carbon Nanotube Interconnects for Radio Frequency Applications, or applications is not unheard of. In this chapter, demonstration of a successfully CNT flip?chip device at high frequency will be done. A parametric study using hybrid EM/analytical modeling of the device will be conducted.

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Nanopackaging Requests for Atomic Scale Circuits and Molecule-Machines,g power of a large atomic scale circuit. This has many consequences on the final packaging of such a circuit while preserving the atomic scale precision of its construction and while offering a large number of interconnects from the atomic scale to the external world.

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Conference proceedings 2015book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

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